半导体设备

• 实验室设备，代表最新的C-SAM^?声学显微成像技术

• 专为故障分析、工艺开发、材料特性和小批量的生产检测而设计

• 多门控?成像和探测门控?功能的PolyGate?技术具有单层和多层聚焦成像的能力

• 每个通道可达100个门

• 倒喷水扫描设计结构?特殊功能，搭载在D9650平台上的D9650Z机台

• Windows^? 10多语言终极版及64位能力

• 精确的扫描，以扫描机构为参照点的扫描平台和样品夹具

• 还有数字图像分析(DIA?)、水循环、瀑布式换能器及在线温度控制等选项

●适应6至12英寸晶圆

●可测试IL/PDL/RF/DC

●晶圆级测试

●光栅耦合/边耦合测试

●快速耦合 (<1s)

●超高耦合重复性 (<0.1dB)

●设备尺寸: 1200X1200X2000

●高精度透镜/光纤整列耦合封装

●物料全自动拾取

●物料通过传送带传输

●超快速耦合算法

●多种耦合方式（功率测量，电流测量，光斑测量)

●设备尺寸: 1200X1200X2000

●高精度透镜/光纤整列耦合封装

●物料全自动拾取

●超快速耦合算法

●多种耦合方式（功率测量，电流测量，光斑测量)

●设备尺寸: 1200X1200X1800

●芯片p面，n面，腔面自动镜检

●深度学习镜检App

●芯片自动筛选

●生产型快速镜检

●芯片通过蓝膜或胶盒上料

设备尺寸: 1600X1400X2000

●自动叠巴拆巴

●可放8个2英寸胶盒

●最小可拾取芯片腔肠150um

●配有2个6英蓝膜台

●可选配镜检功能  

设备尺寸: 1600X1400X2000

●多功能贴片设备

●高精度贴片 (3-5um)

●物料全自动拾取

●多种贴片方式 (共晶, 银胶, 紫外胶固化，激光焊接)

●可加载最多8个2”胶盒

●可加载最多1个6英寸蓝膜

●自动换头功能

●设备尺寸: 1600X1400X2000

1.  Sturdy and stable design
2.  User friendly “soft touch” LED membrane control panel
3.  Pneumatic clamps provided for magazine alignment
4.  Pneumatic pusher’s pressure regulated
5.  High throughput with short magazine change-over time
6.  SMEMA compatible

1.    高精度和高分辨率

2.    高速批量检查

3.    各种分析App不断深化多样

4.    可操作性强，安全性高

1.  Dual cassette load station to minimize idle time.
2.  Multi-sizes capable aligner with minimal hardware change-over required.
3.  Robust robotic wafer engine.
4.  Integrated wafer recognition for high reliability wafer handling.
5.  Compact design minimize floor space.
6.  Unique kits allow fast change-over between wafer sizes and supports multi-load for smaller wafer sizes.
7.  Highly uniform treatment and fast throughput.

1.  PLC controller with touch screen provides an intuitive graphical interface and real time process representation.
2.  Flexible shelf architecture allows processing of a wide variety of part carriers in either direct or downstream plasma mode.
3.  The 13.56 MHz power supply has automatic impedance matching for unparalleled process reproducibility.
4.  Proprietary software control system generates process and production data for statistical process Control.

1.  Touch screen control and graphical user interface give real-time process information
2.  Flexible shelf architecture allows process of a wide variety of piece parts, components or carriers 
3.  13.56MHzRF generator with automatic matching network delivers excellent process repeatability.
4.  Convenient facility hook-ups for periodic calibration requirement used in validation process.

1.  Highly uniform plasma with fast treatment rates
2.  Production-ready strip handling system
3.  Easy-to-use touch screen graphical user interface (GUI)
4.  Service components accessible via front pull-out shelves
5.  High throughput, small footprint, low cost of ownership

1.  Flexible configuration accommodates the full range of strip dimensions and magazine designs
2.  Advanced robotic handling system minimizes strip handling, pushing, pulling and reduces operator intervention 
3.  New camera-based material tracking provides 100% plasma treatment validation 
4.  High-efficiency, application specific, plasma chamber design offers Direct or Ion Free plasma treatment modes 
5.  Significantly smaller system footprint and magazine reuse capability save space and help lower cost of ownership

1.    Dage4000推拉力测试系统用于半导体或光电,电路板组装业。适用于所有的 Pull拉力和 Shear 推力测试，可达到高精度，高重复性，高再现性。 
2.    摇杆操作，简便易学； 
3.    马达驱动 X,Y 工作台； 
4.    适用于半导体各种封装形式测试金铝线黏合力；及COB封装、光电,LED,SMT组装 , 原件与基板黏合测试。

1.  High versatile

2.  Switch applications in just seconds

3.  Increased efficiency

4.  Ultimate step back accuracy

5.  Ultimate correlation

6.  Intelligent software

1.  Fastest and most accurate bond tester

2.  Ultimate speed and flexibility

3.  Extensive application capability

1.  High Speed Inspection Head for Higher Throughput

2.  Lower Cost $ per unit LED

3.  Faster Return-of-Investment (ROI)

4.  Multi Wires on Multi Dice Inspection for more device configuration

5.  Foreign Material Inspection (Optional)

6.  Simplified Angle View Setup

7.  Simplified Recipe Setup

8.  Reinforced Machine Base for Lower Vibration

1.    高解析度CCD图像扫描系统，有进行料片位子校正和辨认入料方向等功能。

2.    拼图技术智慧型扫描功能 – 可排除缺料点胶和解决后段设备卡料等问题。

3.    点胶阀体配搭胶针位置校正、清胶、监视等功能，操控人性化。

4.    诺配搭NSW 特制精密、高速点胶阀PP2D，可实现翻倍的实际产能。

5.    多功能点胶模式 - 提高 LED 封装可靠性、性能和材料利用率。

6.    Ndisp3 软体操控界面，性能现代化且适用于多类产品变化性生产。

7.    机身体积较小而且节省车间占据空间，发挥“空间小用意大”的作用。

1.   Multiple Magazine Loader (3~6 Magazines)

2.   Automatic Strip Width Conversion (Single & Matrix Boat)

3.   Mechanical Pre-alignment by Precise Jig 

4.   X- Y -Z Position Control By Servo Motor

5.   Flux Squeegee & Pin Dotting Fluxing

6.   5 Vision Inspection System

（1） PCB PRS Vision (1.4M CCD)

（2） Auto Set-Up (1.4M CCD)

（3） Ball Volume Detect Vision (1.4M CCD)

（4） Ball Tool Inspection Vision (8M CCD) 

（5） Ball Quality Inspection Vision (8M CCD)