World-Fastest Full 3D Solder Paste Inspection
·The industry's fastest full 3D measuring inspection solution
- Solves shadow problems by utilizing 2-way projection
- Full 3D foreign material inspection for the entire PCB
- Provides accurate inspection data with real-time PCB warp compensation
·Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory
- Realizes real-time process optimization through powerful SPC analytics
- Provides a powerful printing process optimization tool
·Leading model for high-speed mass production line
World-Best Performance 3D Solder Paste Inspection
·Industry-leading measurement accuracy and inspection reliability
- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction
- Full 3D foreign material inspection solution for the entire PCB
- High productivity through the highest accuracy
·Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory
- Real-time process optimization through powerful SPC analytics
- Maintain optimal equipment status with the embedded self-diagnosis function
·The model with the best specification, suitable for variety of production environments
1. Auto-programming, ideal for New Product introduction;
2. In addition to paste inspection, PIE offers simultaneous glue dot inspection;
3. Automatic pad grouping by Area Aperture Ratio;
4. Extra-large review image in textured 3D for easy diagnostic;
5. Real-time Process Monitor with: SIGMA Analysis; Off-line SPC; embedded SPC
6. Z-referencing volume is under estimated on small pads and cropped images around pads, to define stable and accurate;
7. Multi-frequency ,multi pattern Moiré deliver accurate measurement in real production environments with no false calls ;
8. High resolution textured 3D images provide unambiguous information for defect classification .